Electromagnetic Compatibility for Device Design and System by Karl-Heinz Gonschorek

By Karl-Heinz Gonschorek

The Electromagnetic Compatibility has develop into an more and more crucial issue for putting a product at the worldwide, worldwide market.
Fulfilling emission limits and immunity requisites in addition to dealing with it appears advanced situations of incompatibility calls for a deeper figuring out of the actual interrelations and of Maxwell’s concept.

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B) vertically polarized waves (Fig. 4), The H-vector lies in the reflection plane. c) elliptically polarized waves (See annex chapter A5). The E-vector consists of 2 or 3 orthogonal components with different phases. In Fig. 3 an electromagnetic wave (horizontally polarized) is shown, which is impinging on a metallic wall at an angle α and which is totally reflected. The reflection pattern of a standing wave is also shown. h HE l/ c 0 EE = 2f 2 h SR ER SE 2 EE HR h min = aa l 2 cos a x k E E = EE + ER= 0 Fig.

Taking the arrangement of Fig. 1 and using Eq. 31) of chapter 7, which is valid for wire meshes (in this case meaning for two parallel arrangements intersecting by 90°), a shielding efficiency of 35 dB is obtained. 2: The influence of an additional ground trace on a printed circuit board is to be investigated. The flat tracks are replaced by cylindrical wires. The cross-section of the cylindrical wires is chosen in such a way that they present the same surface as the flat tracks they replaced. 5.

An area of interest is the effect of the amplitude and the steepness of an impulse on the arrangement. A ‘logic family 74HC’ is operating with a switching voltage of 5 V and a gradient of 5 V within 6 ns. In Fig. 6 a plot of the rise of the logic impulse and the coupling of the impulse into the second line is shown. Fig. 1 Effects of electric fields and their calculation 27 The increased decoupling observed previously in the frequency range can also be observed in the amplitudes of the impulses.

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